 1 Offered at Best Price
APPLIED MATERIALS ENDURA® CuBS™ SIP ENCORE™
AMAT Endura® 5500 SIP EnCoRe™ System.
Process Capabilities: Hot Al, SIP TTN, SiP Encore® Cu, SIP Encore™ Ta(N) and CleanW™
Application: Copper Barrier Seed
November 2007 build, installed Jan 2008, low usage
In addition to this Applied Materials, Inc. Endura--5500 SiP Encore, Capovani Brothers Inc. stocks a variety of other used and refurbished Thin Film Deposition tools including Sputtering,
Electron Beam Evaporators (E Beam) and Thermal Evaporators (Resistive Evaporators). Typical manufactures include Airco Temescal, Applied Materials,
CHA Industries, CVC, Denton, Dynavac, Edwards, Leybold, Oerlikon, Temescal, Varian, Veeco Instruments and VonArdenne.
To view our complete stock of used physical vapor deposition equipment, visit our Physical Vapor Deposition Equipment Category.
Learn more about our Physical Vapor Deposition (PVD) Equipment Refurbishment and Functional Testing Procedures
This used sputtering system and all the other used and refurbished semiconductor, scientific, and laboratory equipment listed on this website are owned by
Capovani Brothers Inc. and stored at our facility in Scotia, NY.
Sell us your used, surplus or idle assets! Send us your surplus equipment list
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| Unit Price |
Unstated |
| Number of Units |
1 |
| Manufacturer | Applied Materials |
| Model | Endura--5500 SiP Encore |
| Wafer Size Range | |
| | Minimum | 150 mm |
| Maximum | 200 mm |
| Set Size | 200 mm |
| Number of Chambers | 5 |
| Process Capabilities | Hot Al, SIP TTN, SiP Encore Cu & Ta(N), CleanW |
| Chamber 1 Description | Enhanced Hot Aluminum
Standard Body Chamber
Mech. Clamped chuck, Ti clamp ring
CTI Onboard Cryo, fast regen, low vibe
Magnet type: 12.9" Al A,P/N: 0020-26822 |
| Chamber 2 Description | Ti Nitride
Wide Body Chamber
Elec. Chuck: Bias MCS ESC, SST cover ring
Wafer bias power supply, 13.56MHz 600 W,
CTI Onboard Cryo, fast regen, low vibe
Magnet type: SIP REV2, P/N: 0010-04065
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| Chamber 3 Description | SIP Encore® Cu
Wide Body Chamber
Elec. Chuck: SLT FDR E-Chuck, Ti cover ring, cryo chilled
Wafer bias power supply, 13.56MHz 1250 W,
CTI Onboard Cryo, fast regen, low vibe
Magnet type: LP 8.8, P/N: 0010-12864
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| Chamber 4 Description | SIP Encore® Ta(N)
Wide Body Chamber
Elec.Chuck: SLT FDR E-Chuck, Ti -Arc-Sp
Wafer bias power supply, 13.56MHz 600W, ICE RF Match
CTI Onboard Cryo, fast regen, low vibe
Magnet Type: Encore Rev 2, P/N:0010-14875 |
| Chamber 5 Description | CleanW® PVD
Wide Body Chamber
Elec. Chuck: MCS+ ESC, SST-Arc-Sp cover ring
CTI Onboard Cryo, fast regen, low vibe
Magnet type: PVD WII, P/N: 0010-11925
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| Interface Type | SECS RS-232 |
| Elevator Type | Universal Manual w/Rotate |
| External Cooling | Water Cooled |
| Accessories | (3) CTI 9600 Compressor, p/n: 3620-01389, water cooled
(3) CTI Onboard Terminal, p/n: 3620-01553
(2) Neslab System III Heat Exchanger
(1) CTL Inc subzero chiller, Model: BCU-L310F1-AMAT
(1) Toyota T100L Dry Pump
(2) Toyata T600 Dry Pump
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| Other Information | Buffer Chamber
Position "A": Pass thru with clear plastic lid
Position "B": Cooldown with temp monitor
Position "D": Reactive Preclean, Leybold TMP
Position "E" Orienter degas with temp feedback
Position "F" Orienter degas with temp feedback
Wide Body Loadlocks w/ variable speed soft vent
VHP Transfer Robot w/HTHU compatible blade
HP+ Buffer Robot with w/original metal blade
50' Cable harness
SMIF Integrated Tool Control
NB: Asyst SMIF Loader sold as option.
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| Power Requirements | 480 V 500.0 A 60 Hz 3 Phase
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| CE Marked | YES |
| Year of Manufacture | 2007 |
| Condition | Excellent |
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