
1 Offered at Best Price

EV GROUP 540 WAFER BONDER
2005 EVG 540 Wafer Bonder for all wafer bonding processes, such as anodic, thermo-compression and silicon direct bonding.
EVG Smartview Water to Wafer Bond Aligner see item 148001
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| Unit Price |
Unstated |
| Number of Units |
1 |
| Manufacturer | EVG |
| Model | 540 |
| Description | Fully-Automated Production Wafer Bonder |
| Wafer Size Range |  |
 | | Minimum | 150 mm |
| Maximum | 300 mm |
| Set Size | 300 mm |
| Other Information | •One universal bond chamber with automated opening/closing
• Control unit and PC
• Cooling station
• Send/Receive Station for bond chuck to be processed
• Fully automated bond chuck handling with motorized linear axis
Bond Module
• Fully compatible with GEMINI Production Bonder
• Aluminium bond chamber, O-ring sealed
• Universal cover with top side heater and pressure insert
• Up to 550 °C and 3.5 kN (790 lbf)
• High voltage fed through
• Atmospheric capabilities down to 1x10 -5 mbar (7.5 x 10 -6 Torr)
• Pump time < 3min from 1000 to 1 x 10 -3 mbar
• Purge time < 10sec from high vacuum to 1 bar
• Separate connections for evacuation, purge and vent
Electronics and Pneumatics:
• High voltage power supply 0 - 2000 V / 0 - 50 mA
• Independent temperature controllers for top and bottom side
• Electronic pressure regulator for controlled contact force
• Valve controller for vacuum equipment with analog input for fullrange gauge
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| Year of Manufacture | 2005 |
| Refurbished | YES |
| CE Marked | YES |
| Exterior Dimensions |  |
 | | Width | 36.000 in (91.4 cm) |
| Depth | 56.000 in (142.2 cm) |
| Height | 80.000 in (203.2 cm) |
| Weight | 1,284 lb (582 kg) |