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in Other Wafer Fabrication Equipment
Item ID: 181447

Offered1 Offered at Best Price


Wafer Substrate Bonding Unit

Bonding techniques for the processing of thin and fragile II-VI and III-V
semiconductor wafers such as silicon, GaAs and InP which require delicate handling procedures.
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Unit Price Unstated
Number of Units 1
Manufacturer Logitech
Model WSB2
Description Wafer Substrate Bonding Unit
Wafer Size Range 
  Set Size 100 mm
Other Information 

Maximum Support Disc Size
   Diameter: 108mm
   Thickness:  8mm

Extended Description Details at Logitech WSB2 Substrate Bonding Unit.pdf
Power Requirements 115 V     50/60 Hz     1¬†Phase
CE Marked YES
Exterior Dimensions 
  Width 13.780  in  (35.0 cm)
  Depth 22.835  in  (58.0 cm)
  Height 20.472  in  (52.0 cm)
Weight 70  lb  (32 kg)

Shipping & Handling:

Unless otherwise stated, all items will be fully tested and sold with our standard ninety day warranty, which is described in our terms and conditions. 
Our standard procedure is to service the equipment as orders are placed. Lead times can vary depending on the item.
Domestic and International shipments: Ex Works, Scotia, NY. All freight cost estimates are for dock to dock service only.
Any additional services, i.e. lift-gate, inside or residential delivery, must be requested at the time of sale and will be billed accordingly.
CBI is not responsible for any damage incurred during shipment. It is the buyer's responsibility to inspect packages for damage and to note any damage on bill of lading.
Please feel free to call us with any questions. (Phone: 518.346.8347, Fax: 518.381.9578).

Minimum order of $50 required.
We offer terms of net 30 days to all companies that have established credit with Capovani Brothers Inc. and have paid within terms.
All federal, state, local governments and their agencies, as well as institutions of higher learning automatically receive terms.
All other sales, including foreign sales, are prepayment only.
MasterCard, VISA, Discover and AMEX are accepted at sellers discretion.

Domestic Terms and Conditions

International Terms and Conditions