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EV GROUP 540 WAFER BONDER

EV GROUP 540 WAFER BONDER


2005 EVG 540 Wafer Bonder for all wafer bonding processes, such as anodic, thermo-compression and silicon direct bonding.

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Items from the following manufacturers are offered under Wafer Fabrication Equipment:
Advanced Energy, Airco Temescal, Anatech Ltd, Applied Materials, Inc., Astex, Asyst Technologies, Balzers, BLE-SussMicrotec, Bold Technologies, Branson/IPC, Brewer Science, Brooks Automation, Bruker, Burleigh, C&D Semiconductor, Canary Technology, CHA Industries, Coherent, Comdel, Con Optics, Consolidated Vacuum Corp, Copley Controls Corp., CPA, CVD Equipment Corp, Denton, Eaton, Electronic Measurements Inc, Elgar, ENI Power Systems, Equipe Technologies, EVG, Eye Ultraviolet, Gatan, Genmark Automation, GL Automation, GSI Lumonics, Incorporated, H-Square, Hamatech, Headway, Heraeus, Hewlett Packard, Hinds Inst, Hitachi, Hughes, Inficon, Instron, Interlab, Karl Suss, Kepco, Kokusai, Lacotech, LAM Research Corp., Lambda, Laurell, Leybold, Logitech, Lufran, Mactronix, March Instruments, Materials Research Corp, Melles Griot, Metroline, Mill Lane Engineering, MKS Instruments, Inc., MRL Industries, Neturen, Nexx Systems, Optical Associates, Oxford Instruments, Perkin Elmer, Plasma-finish Enterprise, Plasma-Therm, PlasmaQuest, Polytec, Power Ten Inc, Quintel, RF Power Products, Sairem, Semi-Tool, Semitool, Sharon Vacuum , Silicon Valley Group, Solitec, Sorensen, Spectra-Physics, Surface Technology Systems, Suss Microtec, TDK-Lambda, Tegal, Tektronix, Telemark, Temescal, Thermco, Thermtech, Ulvac, Varian, Veeco Instruments, Verteq, Yaskawa Electric Cor, Yield Engineering Systems