|
Item ID |
Photo |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
Make |
Model |
|
|
$ |
|
|
87948
|
Applied Materials
|
Applied Materials |
8300 |
in Single Chamber Plasma Tools
APPLIED MATERIALS CONTROLLER:Controller
|
1
|
|
|
|
|
|
87949
|
Applied Materials
|
Applied Materials |
8300 |
in Single Chamber Plasma Tools
APPLIED MATERIALS SYSTEM ELECTRONICS RACK:System Electronics Rack
|
1
|
|
|
|
|
|
114961
|
Advanced Plasma Syst
|
Advanced Plasma Syst |
B Series-4 |
in Plasma Etch Equipment
APS MARCH B SERIES-4 PLASMA TREATMENT SYSTEM. :Plasma Treatment System Desmear/Etchback
Advanced Plasma Systems and March Instruments, manufacturer of plasma systems, were aquired by Nordson. Both companies merged and are an entity of Nordson - now called Nordson MARCH.
|
1
|
|
|
F* |
|
|
189241
|
Branson/IPC
|
Branson/IPC |
7102 |
in Plasma Etch Equipment
BRANSON TEPLA PVA PLASMA ETCHER 1000 WATT:Plasma Etcher
|
1
|
|
|
F* |
|
|
34890
|
LAM Research Co
|
LAM Research Co |
490 AUTO ETCH |
in Single Chamber Plasma Tools
LAM RESEARCH SIX INCH NITRIDE ETCHER:Six Inch Nitride Etcher
Automated Cassette to Cassette single wafer etching.
|
1
|
|
|
F* |
|
|
108528
|
March Instruments
|
March Instruments |
PM-600 |
in Plasma Etch Equipment
MARCH INSTRUMENTS BARREL PLASMA ETCHER 300 WATT:Barrel Plasma Etcher with Vacuum Pump March Instruments, manufacturer of plasma systems, was acquired by Nordson - called Nordson MARCH.
|
1
|
|
|
F* |
|
|
177136
|
March Instruments
|
March Instruments |
PX-2400 |
in Plasma Etch Equipment
MARCH NORDSON BOX PLASMA ETCHER 1000 WATT 13.56 MHz:Box Plasma Etcher Applications "Gas plasma treatment provides a fast, efficient method for surface treatment and cleaning prior to wire bonding, die attach, encapsulation, conformal coating and other processes. Plasma processing enhances lamination bondstrength, improves wire bond strength and uniformity,promotes underfill adhesion and enhances die attach." Source -- March Nordson.
|
1
|
|
|
|
|
|
199963
|
March Instruments
|
March Instruments |
PX-500 |
in Plasma Etch Equipment
MARCH NORDSON BOX PLASMA ETCHER 600 WATT 13.56 MHZ:Box Plasma Etcher
|
1
|
|
|
F* |
|
|
208462
|
Plasma-finish
|
Plasma-finish |
V15G |
in Plasma Etch Equipment
PLASMA-FINISH GMBH PLASMA ETCHER SYSTEM 300 WATT:Plasma Box Etcher System PINK GmbH acquired Plasma-Finish - now called PINK GmbH Plasma-Finish
|
1
|
|
|
|
|
|
3011
|
Plasma-Therm
|
Plasma-Therm |
Wafer Batch 740/740 |
in Single Chamber Plasma Tools
PLASMA-THERM DUAL PLASMA ETCH AND REACTIVE ION ETCH SYSTEM 200MM:Dual Plasma Etch and Reactive Ion Etch Processing Systems
System consists of a process chamber, upper electrode (with gas feed), and substrate electrode.
|
1
|
|
|
|
|
|
4054
|
Plasma-Therm
|
Plasma-Therm |
73/74 |
in Single Chamber Plasma Tools
PLASMA-THERM PECVD AND DUAL PLASMA ETCH/REACTIVE ION ETCH SYSTEM:Combination PECVD and Dual Plasma Etch/Reactive Ion Etch Processing Systems
|
1
|
|
|
|
|
|
50854
|
Plasma-Therm
|
Plasma-Therm |
VII 734 |
in Single Chamber Plasma Tools
PLASMA-THERM PLASMA DEPOSITION SYSTEM/RIE:Combination Plasma Deposition System/RIE
|
1
|
|
|
F* |
|
|
11919
|
Plasma-Therm
|
Plasma-Therm |
VII 734MF |
in Single Chamber Plasma Tools
PLASMA-THERM REACTIVE ION ETCH/PLASMA ETCH SYSTEM:Plasmatherm RIE/Plasma Etch System
|
1
|
|
|
F* |
|
|
206582
|
Plasma-Therm
|
Plasma-Therm |
BT 6" RIE MF |
in Single Chamber Plasma Tools
PLASMATHERM BatchTop VII REACTIVE ION ETCH SYSTEM 6":Reactive Ion Etch System BatchTop VII
|
1
|
|
|
|
|
|
45428
|
Plasma-Therm
|
Plasma-Therm |
790 ICP |
in Single Chamber Plasma Tools
PLASMATHERM ICP PLASMA ETCHER:Inductively Coupled Plasma Etcher with 9.5 Inch Electrode
|
1
|
|
|
F* |
|
|
124315
|
Plasma-Therm
|
Plasma-Therm |
790 11" RIE |
in Single Chamber Plasma Tools
PLASMATHERM REACTIVE ION ETCH SYSTEM 11":Reactive Ion Etch System - 11" Electrode
|
1
|
|
|
F* |
|
|
45430
|
Plasma-Therm
|
Plasma-Therm |
790 11 RIE |
in Single Chamber Plasma Tools
PLASMATHERM REACTIVE ION ETCH SYSTEM 200MM:Reactive Ion Etch System 11" Electrode
|
1
|
|
|
|
|
|
201152
|
Plasma-Therm
|
Plasma-Therm |
790 RIE PECVD 11" |
in Single Chamber Plasma Tools
PLASMATHERM RIE PECVD MOUNTED IN GLOVEBOX:Reactive Ion Etch / PECVD system mounted in glovebox with an intregrated air purfier O2 and H20 sensors on board.
Both top and bottom electrodes can be powered sequentially.
|
1
|
|
|
|
|
|
142821
|
Plasma-Therm
|
Plasma-Therm |
Unaxis 790 |
in Single Chamber Plasma Tools
PLASMATHERM UNAXIS DUAL CHAMBER SHUTTLE LOAD LOCK SYSTEM:Shuttle Load Lock System
|
1
|
|
|
|
|
|
84296
|
Surface Tech Sys
|
Surface Tech Sys |
308 PC |
in Plasma Etch Equipment
STS SURFACE TECHNOLOGY SYSTEMS BARREL PLASA ETCHER 600 WATT:Barrel Plasma Etcher
|
1
|
|
|
|
|
|
147500
|
Surface Tech Sys
|
Surface Tech Sys |
MXP Multiplex ICP HR |
in Single Chamber Plasma Tools
SURFACE TECHNOLOGY SYSTEMS MXP ICP HR:Chlorine Etcher - Year 2003
|
1
|
|
|
|
|
|
102178
|
Surface Tech Sys
|
Surface Tech Sys |
MXP Multiplex ICP ASE HR |
in Single Chamber Plasma Tools
SURFACE TECHNOLOGY SYSTEMS STS SILICON ICP ETCHER:Silicon Etcher - Year 2003
|
1
|
|
|
|
|
|
184779
|
Technics
|
Technics |
Micro Stripper -- Series 200 |
in Single Chamber Plasma Tools
TECHNICS PLASMA ETCHER 200 WATT 13.65 MHz:Technics Micro Stripper Series 200 Plasma System
|
1
|
|
|
F* |
|
|
181401
|
Tepla
|
Tepla |
4011 |
in Plasma Etch Equipment
TEPLA PLASMA ETCHER 4000 WATT:Planar Plasma Etcher
|
1
|
|
|
F* |
|
|
119294
|
Trion Technology
|
Trion Technology |
Oracle |
in Cluster Plasma Tools
TRION TECHNOLOGY DIELECTRIC CLUSTER TOOL:Dielectric Cluster Tool
Trion Technology Oracle
|
1
|
|
|
F* |
|
|
126704
|
Ulvac
|
Ulvac |
NE 7800 Ferroelectric Etcher |
in Cluster Plasma Tools
ULVAC FERROELECTRIC ETCHER:Like New Condition System installed in October of 2007, decommission in Feburary of 2008. Used in a R&D application
The Ulvac NE 7800 is a high-temperature, high-density plasma etching system utilizing an Inductive Super Magnetron source (ICP with magnetic field). The NE 7800 is a dual load locked, cassette to cassette system designed for both R&D and production applications. Outstanding metal etching process stability for Pt/Ir/magnetic films and difficult to etch materials such as FeRAM and MRAM devices.
|
1
|
|
|
F* |
|