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Your search for Manufacturer: EVG
found:
  • 4 individual listing(s) with a matching description:
    •  Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Note
    Make Model
      $  
    Offer 71112

    EVG

    EV640

    List all items of this typeWafer Fabrication Equipment - Other

    in Wafer Fabrication Equipment

    		 1
      EV GROUP SMARTVIEW BOND ALIGNER
    Wafer to Wafer Bond Aligner
    Some Shown, Others Not 124309

    EVG

    AB1-PV

    List all items of this typeWafer Fabrication Equipment - Other

    in Wafer Fabrication Equipment

    		 1
      EV GROUP BENCH TOP ANODIC WAFER BONDER
    Bench Top Anodic Bonder

    EVG AB1-PV
    Offer 148001

    EVG

    Smartview Bond Aligner

    List all items of this typeWafer Fabrication Equipment - Other

    in Wafer Fabrication Equipment

    		 1
      EV GROUP SMARTVIEW® BOND ALIGNER
    2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner
    2005 EVG 540 Fully-Automated Production Bonder

    The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

    A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.
    Offer 148005

    EVG

    540

    List all items of this typeWafer Fabrication Equipment - Other

    in Wafer Fabrication Equipment

    		 1 F*
      EV GROUP 540 WAFER BONDER
    2005 EVG 540 Wafer Bonder for all wafer bonding processes, such as anodic, thermo-compression and silicon direct bonding.


    EVG Smartview Water to Wafer Bond Aligner see item 148001


    *  Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer
    NOTE:
       when photo available
       when document attached
      F* if the item is specially featured
      N* if the item is newly added, and/or
      R* if the item's price is recently reduced.