Other Information | •One universal bond chamber with automated opening/closing • Control unit and PC • Cooling station • Send/Receive Station for bond chuck to be processed • Fully automated bond chuck handling with motorized linear axis Bond Module • Fully compatible with GEMINI Production Bonder • Aluminium bond chamber, O-ring sealed • Universal cover with top side heater and pressure [INVALID] • Up to 550 °C and 3.5 kN (790 lbf) • High voltage fed through • Atmospheric capabilities down to 1x10 -5 mbar (7.5 x 10 -6 Torr) • Pump time < 3min from 1000 to 1 x 10 -3 mbar • Purge time < 10sec from high vacuum to 1 bar • Separate connections for evacuation, purge and vent Electronics and Pneumatics: • High voltage power supply 0 - 2000 V / 0 - 50 mA • Independent temperature controllers for top and bottom side • Electronic pressure regulator for controlled contact force • Valve controller for vacuum equipment with analog input for fullrange gauge |