Item ID: 148005

**1 Offered at Best Price**

EV GROUP 540 WAFER BONDER

2005 EVG 540 Wafer Bonder for all wafer bonding processes, such as anodic, thermo-compression and silicon direct bonding.

EVG Smartview Wafer to Wafer Bond Aligner see item 148001

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Location: Scotia, New York, United States

Unit Price	Unstated
Number of Units	1
Manufacturer	EVG
Model	540
Description	Fully-Automated Production Wafer Bonder
Wafer Size Range
Minimum	150 mm
Maximum	300 mm
Set Size	300 mm
Accessories	Neslab M75 Chiller
Other Information	•One universal bond chamber with automated opening/closing • Control unit and PC • Cooling station • Send/Receive Station for bond chuck to be processed • Fully automated bond chuck handling with motorized linear axis Bond Module • Fully compatible with GEMINI Production Bonder • Aluminium bond chamber, O-ring sealed • Universal cover with top side heater and pressure [INVALID] • Up to 550 °C and 3.5 kN (790 lbf) • High voltage fed through • Atmospheric capabilities down to 1x10 -5 mbar (7.5 x 10 -6 Torr) • Pump time < 3min from 1000 to 1 x 10 -3 mbar • Purge time < 10sec from high vacuum to 1 bar • Separate connections for evacuation, purge and vent Electronics and Pneumatics: • High voltage power supply 0 - 2000 V / 0 - 50 mA • Independent temperature controllers for top and bottom side • Electronic pressure regulator for controlled contact force • Valve controller for vacuum equipment with analog input for fullrange gauge
Year of Manufacture	2005
Refurbished	YES
CE Marked	YES
Exterior Dimensions
Width	36.000 in (91.4 cm)
Depth	56.000 in (142.2 cm)
Height	80.000 in (203.2 cm)
Weight	1,284 lb (582 kg)

Shipping & Handling:

Unless otherwise stated, all items will be fully tested and sold with our standard ninety day warranty, which is described in our terms and conditions.
Our standard procedure is to service the equipment as orders are placed. Lead times can vary depending on the item.
Domestic and International shipments: Ex Works, Scotia, NY. All freight cost estimates are for dock to dock service only.
Any additional services, i.e. lift-gate, inside or residential delivery, must be requested at the time of sale and will be billed accordingly.
CBI is not responsible for any damage incurred during shipment. It is the buyer's responsibility to inspect packages for damage and to note any damage on bill of lading.
Please feel free to call us with any questions. (Phone: 518.346.8347, Fax: 518.381.9578).

Payment:

Minimum order of $50 required.
We offer terms of net 30 days to all companies that have established credit with Capovani Brothers Inc. and have paid within terms.
All federal, state, local governments and their agencies, as well as institutions of higher learning automatically receive terms.
All other sales, including foreign sales, are prepayment only.
MasterCard, VISA, Discover and AMEX are accepted at sellers discretion.

Domestic Terms and Conditions

International Terms and Conditions

FULL DESCRIPTION of Item 148005

1 Offered at Best Price

EV GROUP 540 WAFER BONDER

**1 Offered at Best Price**