Item ID: 181447
LOGITECH WAFER SUBSTRATE BONDING UNIT
Wafer Substrate Bonding UnitBonding techniques for the processing of thin and fragile II-VI and III-V semiconductor wafers such as silicon, GaAs and InP which require delicate handling procedures.
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Location: Scotia, NY, United States
Number of Units
Description Wafer Substrate Bonding Unit
Wafer Size Range
Set Size 100 mm
Other Information Maximum Support Disc Size Diameter: 108mm Thickness: 8mm
Details at Logitech WSB2 Substrate Bonding Unit.pdf
Power Requirements 115 V
CE Marked YES
Exterior Dimensions Width 13.780 in (35.0 cm)
Depth 22.835 in (58.0 cm)
Height 20.472 in (52.0 cm)
Weight 70 lb (32 kg)
Shipping & Handling:Unless otherwise stated, all items will be fully tested and sold with our standard ninety day warranty, which is described in our terms and conditions. Our standard procedure is to service the equipment as orders are placed. Lead times can vary depending on the item.Domestic and International shipments: Ex Works, Scotia, NY. All freight cost estimates are for dock to dock service only.Any additional services, i.e. lift-gate, inside or residential delivery, must be requested at the time of sale and will be billed accordingly.CBI is not responsible for any damage incurred during shipment. It is the buyer's responsibility to inspect packages for damage and to note any damage on bill of lading.Please feel free to call us with any questions. (Phone: 518.346.8347, Fax: 518.381.9578).
Payment:Minimum order of $50 required.
We offer terms of net 30 days to all companies that have established credit with Capovani Brothers Inc. and have paid within terms.
All federal, state, local governments and their agencies, as well as institutions of higher learning automatically receive terms.
All other sales, including foreign sales, are prepayment only.
MasterCard, VISA, Discover and AMEX are accepted at sellers discretion.
Domestic Terms and Conditions
International Terms and Conditions
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Maximum Support Disc Size Diameter: 108mm Thickness: 8mm