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Your search for Manufacturer: West-Bond
	found:

4 Listing(s) with a matching description:

	Item ID	Photo	Short Description		Product Type / Details	#		Price	Notes
	Item ID	Photo	Make	Model	Product Type / Details	#		Price	Notes
								$
	55707	West-Bond	West-Bond	8500	Automatic Wedge Bonders in Wedge Bonders WEST-BOND AUTOMATIC WEDGE BONDER: *Automatic Wedge Bonder* Designed for RF,microwave and high-lead count semiconductor devices Bonds ultrasonically or thermosonically	1			F*

	172393	West-Bond	West-Bond	4500B	Manual Wedge Bonders in Wedge Bonders WEST-BOND SEMIAUTOMATIC WEDGE BONDER: Semi-Automatic Wedge Bonder Model 4500B operates under microprocessor control with user-programmed memory to stitch bond a succession of parallel multi-arch wires, requiring an operator only to position the critical bond target. Each increment of motion of tool and work in both Z and Y directions is chosen by stepper motors under program control so that the resulting wire connections have identical shapes. This is ideal for bonding high power, high frequency devices where it is necessary to hold the mutual inductance of parallel wires constant.	1

	181804	West-Bond	West-Bond	7600B	Manual Wedge Bonders in Wedge Bonders WEST-BOND MANUAL WEDGE BONDER: Manual Wedge Bonder	1

	3897	West-Bond	West-Bond	7440A (formerly 7400IW)	Manual Wedge Bonders in Wedge Bonders WEST-BOND ULTRASONIC WEDGE WIRE BONDER: *Ultrasonic Wedge Wire Bonder* Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices. Machine bonds insulated wire directly to thin film gold without the need to strip off insulation Representative photo	8			F*

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Manufacturers whose products we service and sell include:

A&N Corporation, Adixen, Advanced Energy, Aerotech, Alcatel, Applied Materials AKT, Applied Materials, Inc., Balzers, Balzers-Pfeiffer, Bausch & Lomb, Inc, Blue M, Branson/IPC, Brookfield Engineering Labs, Brooks Automation, Brooks Instrument, Buehler, Cascade Microtech, Cascade TEK, CBI, Compumotor, CTI Cryogenics, CVI, Daedal, Despatch, DMS, Ebara, Edwards, Efos, Electronic Measurements Inc, ENI Power Systems, GGB Industries Inc., Glassman, Granville Phillips, Hewlett Packard, HPS, Huntington, HVA, Inficon, Instron, Ion Systems, Karl Suss, Key High Vacuum, Kinetic Systems, Inc., Kulicke & Soffa, Kurt Lesker, Labsphere, Lambda, Laminaire, Leica, Leica, Leitz, Leybold, Logitech, March Instruments, MDC, Meivac Inc., Melles Griot, Micromanipulator, Millipore Tylan, MKS Instruments, Inc., MV Products, Mykrolis, New Focus, Newport, Nikon, Nor-Cal Products, Oerlikon Leybold, Olympus, Optosigma, Oriel, Osaka Vacuum Ltd., Particle Measurement Systems, Pfeiffer Vacuum, Plasma-Therm, Power Ten Inc, Process Technology, Seiko-Seiki, Semitool, Sensotec, Seren, Signatone, SMC, Sorensen, TDK-Lambda, Technical Manufacturing Corporation, Temescal, Terra Universal Inc., Thorlabs, Transistor Devices, Unit Instruments, Unknown, Vacuum Atmospheres, Vacuum Research, Varian, VAT, Veeco Instruments, West-Bond, Wild, Yield Engineering Systems, Zeiss

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