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Offered1 Offered at Best Price


EV GROUP SMARTVIEW® BOND ALIGNER


2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner
2005 EVG 540 Fully-Automated Production Bonder


The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.



EV GROUP SMARTVIEW® BOND ALIGNER
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Unit Price Unstated
Number of Units 1
ManufacturerEVG
ModelSmartview Bond Aligner
Description300mm Wafer to Wafer Bond Aligner
Wafer Size Range
  Minimum150 mm
  Maximum300 mm
  Set Size300 mm
Other Information• High resolution alignment stage with DC servomotors in X, Y and Theta
• Alignment accuracy +/- 1 um (one sigma) with 20x objectives
• Top and bottom stage with precision measurement system
• Complete computer control of all mechanical movements in the aligner.
• 17" flat screen for operator interface and alignment functions
• Joystick control of all alignment movements and microscope movement in Z.
• Unique three spindle alignment stage for shift free Z movements
• Remote Diagnostics via modem
Year of Manufacture2005
CE MarkedYES
Exterior Dimensions
  Width52.000  in  (132.1 cm)
  Depth47.000  in  (119.4 cm)
  Height80.000  in  (203.2 cm)
Weight1,534  lb  (696 kg)
 
Shipping & Handling:

Unless otherwise stated, all items are fully tested and sold with our standard ninety day warranty, which is described in our terms and conditions.
Domestic and International shipments: Ex Works, Scotia, NY. All freight cost estimates are for dock to dock service only.
Any additional services, i.e. lift-gate, inside or residential delivery, must be requested at the time of sale and will be billed accordingly.
CBI is not responsible for any damage incurred during shipment. It is the buyer's responsibility to inspect packages for damage and to note any damage on bill of lading.
Please feel free to call us with any questions. (Phone: 518.346.8347, Fax: 518.381.9578).
 
Payment:

Minimum order of $50 required.
We offer terms of net 30 days to all companies that have established credit with Capovani Brothers Inc. and have paid within terms.
All federal, state, local governments and their agencies, as well as institutions of higher learning automatically receive terms.
All other sales, including foreign sales, are prepayment only.
MasterCard, VISA, Discover and AMEX are accepted at sellers discretion.

Domestic Terms and Conditions

International Terms and Conditions

 


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