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Other Wafer Fabrication Equipment

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  • Item IDPhotoItem DescriptionDescriptionSize RangeCass to Cass#PriceNotes
    MakeModelSet Size
    Anelva 32-515-638Shutter Drive Unit2
    EVG 540Fully-Automated Production Wafer Bonder300 mm1
    EVG AB1-PVAnodic Wafer Bonder 1
    EVG EV640Wafer to Wafer Bond Aligner1
    EVG Smartview Bond Aligner300mm Wafer to Wafer Bond Aligner300 mm1
    Logitech BC1Wafer Bonder Controller1
    Logitech WSB2Wafer Substrate Bonding Unit100 mm1 F*
    Reynoldstech CustomHot Plate, 200° C, 16" x 16", Vacuum Hold Down1 5,750.00
    Sharon Vacuum UnknownWafer Bonder1 9,500.00

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      F* if the item is specially featured
      N* if the item is newly added, and/or
      R* if the item's price is recently reduced.

    Items from the following manufacturers are offered under Other Wafer Fabrication Equipment:
    Anelva, EVG, Logitech, Reynoldstech, Sharon Vacuum