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Other Wafer Fabrication Equipment

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Item IDPhotoItem DescriptionDescriptionSize RangeCass to Cass#PriceNotes
MakeModelSet Size
Anelva 32-515-638Shutter Drive Unit2
EVG 540Fully-Automated Production Wafer Bonder300 mm1
EVG AB1-PVAnodic Wafer Bonder 1
EVG EV640Wafer to Wafer Bond Aligner1
EVG Smartview Bond Aligner300mm Wafer to Wafer Bond Aligner300 mm1
Logitech BC1Wafer Bonder Controller1
Logitech WSB2Wafer Substrate Bonding Unit100 mm1
Reynoldstech CustomHot Plate, 200° C, 16" x 16", Vacuum Hold Down1 5,750.00
Sharon Vacuum UnknownWafer Bonder1 9,500.00

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Items from the following manufacturers are offered under Other Wafer Fabrication Equipment:
Anelva, EVG, Logitech, Reynoldstech, Sharon Vacuum