Die Bonders For Semiconductor Assembly

  1. MECH-EL EUTECTIC DIE BONDER

    Manual Eutectic Die Bonders

    MECH-EL EUTECTIC DIE BONDER

    The Mech-El/MEI 709 is a manual eutectic die attacher.  The machine comes with a  2 position slide table for die presentation and heated work holder.  The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.

  2. HYBOND SEMIAUTOMATIC EPOXY DIE BONDER

    Automatic Epoxy Die Bonders

    HYBOND SEMIAUTOMATIC EPOXY DIE BONDER

    Semiautomatic Epoxy Die Bonder