Wafer Film Frame Tape Applicator

The item is sold AS IS without returns.

For parts or not working condition. It is not tested. 

Manual Ball Bonder

Manual Ball Bonder

Manual Wedge Bonder with Leica GZ6 Microscope

The Mech-El/MEI 709 is a manual eutectic die attacher.  The machine comes with a  2 position slide table for die presentation and heated work holder.  The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.

Manual Wedge Bonder with Leica MZ6 Microscope

Dicing Saw Disco DAD 320

Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation

Representative photo

Automatic Wedge Bonder

Semiautomatic Epoxy Die Bonder

Refrigerated Centrifuge Eppendorf 5042

Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically