Features
Black & White CCTV System
Package depth sensor for consistent & precise bond line thickness
Programmable dispense control unit
Storage for up to 99 dispense programs
Manual X-Y alignment
PLC Control
Waffle pack / loose die pickup pedestal
Pitch & Roll adjustments for bond head
Manual & Semiautomatic operation modes
Dispense Materials: Epoxy. Bonder is capable of doing conductive silver glass; option not included available from Hybond
Bond Time Range: 7 to 15 seconds
Bond Force Range: 15 to 50 grams
Bondable Die Size Range: 6 x 6 mils (152 x 152 5m) to 750 x 750 mils (1,9 x 1,9 5m)
Placement Accuracy: 1 1 mil (25,4 5m) standard
Bond Line Accuracy: 1.0.5 mil (1m12,7 l5m)
Bond Head Movement: Motorized, rotational, w/ fixed pick-up and placement points
Bond Actuation: By opto-switch at fixed height. Cycle initiated by footswitch
Z Axis Travel / Vertical Bonding Window: 0.5 in (1.20 cm) / 0.125 to 0.500 in. (0,31 to 1,20 cm)
Table Motion: manual, with thumbscrew adjustments (standard)
