- Number of Chambers
- 4
- Process Capabilities
- Ta, FeRAM, RRAM, MRAM
- Chamber 1 Description
- Preheat Chamber IR heater Range: 200 to 600 deg C
- Chamber 2 Description
- ISM ICP Etch ESD Chuck, 450C, He BS Cooling Bias power: 2000W, 400 KHz Antenna power: 3000W, 13.56 MHZ UTM 1400FW/DIK Turbo Pump Ebara ESR20N Dry Pump Gases: Ar, O2, SF6, C4F8, HBr, CL2, BCl3, CHF3
- Chamber 3 Description
- ISM ICP Etch ESD Chuck, He BS Cooling Bias power: 2000W, 400 KHz Antenna power: 3000W, 13.56 MHZ UTM 1400FW/DIK Turbo Pump Ebara ESR20N Dry Pump Gases: Ar, O2, SF6, C4F8, HBr, CL2, BCl3, CHF3
- Chamber 4 Description
- Microwave Ashing Chamber Heated Chuck, 280C Bias power: 600W, 13.56 MHz Microwave power: 3000W, 2.45 GHz Endpoint detection Ebara ESR200WN Dry Pump Gases: 02, 02, H2/N2, CF4, N2
- External Cooling
- Water Cooled
- Power Requirements
- 208 V 220.0 A 60 Hz 3 Phase
