EV GROUP SMARTVIEW® BOND ALIGNER

Other Wafer Fabrication Equipment

2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner

The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.

1 unit @ Best Price

Make: EVG

Model: Smartview Bond Aligner

Item ID: 148001

Manufacturer	EVG
Model	Smartview Bond Aligner
Description	300mm Wafer to Wafer Bond Aligner
Wafer Size Range
Minimum	150 mm
Maximum	300 mm
Set Size	300 mm
Other Information	• High resolution alignment stage with DC servomotors in X, Y and Theta • Alignment accuracy +/- 1 um (one sigma) with 20x objectives • Top and bottom stage with precision measurement system • Complete computer control of all mechanical movements in the aligner. • 17" flat screen for operator interface and alignment functions • Joystick control of all alignment movements and microscope movement in Z. • Unique three spindle alignment stage for shift free Z movements • Remote Diagnostics via modem
Year of Manufacture	2005
CE Marked	YES
Exterior Dimensions
Width	52.000 in (132.1 cm)
Depth	47.000 in (119.4 cm)
Height	80.000 in (203.2 cm)
Weight	1,534 lb (696 kg)

Shipping & Handling

Unless otherwise stated, all items will be fully tested and sold with our standard ninety day warranty, which is described in our terms and conditions.

Our standard procedure is to service the equipment as orders are placed. Lead times can vary depending on the item.

Domestic and International shipments: Ex Works, Scotia, NY. All freight cost estimates are for dock to dock service only.

Any additional services, i.e. lift-gate, inside or residential delivery, must be requested at the time of sale and will be billed accordingly.

CBI is not responsible for any damage incurred during shipment. It is the buyer's responsibility to inspect packages for damage and to note any damage on bill of lading.

Please feel free to call us with any questions. (Phone: 518.346.8347, 844-833-8347, Fax: 518.381.9578).

Payment

Minimum order of $50 required.

We offer terms of net 30 days to all companies that have established credit with Capovani Brothers Inc. and have paid within terms.

All federal, state, local governments and their agencies, as well as institutions of higher learning automatically receive terms.

All other sales, including foreign sales, are prepayment only.

MasterCard, VISA, Discover and AMEX are accepted at sellers discretion.

Domestic Terms and Conditions

International Terms and Conditions