Wafer size; 150-200mm, Date of Manufacture 2001
Operating system Windows98SE, Software EV 640v166_020815e, Computer boots up. manual is available in electronic form.
According to the manual this bonder is equipped with SBD( silicon direct Bond option)
Bonder is isolated with EVG transport brackets. Bonder was removed from Research Facility (Ziptronix) in Research Triangle Park, NC in 2007. It has been in storage since.
Includes top and bottom Chucks
NB!!!!This item is likely subject to US export control.
SOLD AS IS
HANDLING FEE IS FOR SKIDDING ONLY. Crating service is available, request a quote prior to purchase.
