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Your search for Manufacturer: EVG
found:
  • 3 Listing(s) with a matching description:
 Offered (box) or Wanted (coins)  Item ID  Photo Short Description Product Type / Details # Price Notes
Make Model
  $  
71112
EVG  

EVG  

EV640 

List all items of this typeWafer Fabrication Equipment - Other

in Wafer Fabrication Equipment

1  
EV GROUP SMARTVIEW BOND ALIGNER:
Wafer to Wafer Bond Aligner
148001
EVG  

EVG  

Smartview Bond Aligner 

List all items of this typeWafer Fabrication Equipment - Other

in Wafer Fabrication Equipment

1  
EV GROUP SMARTVIEW® BOND ALIGNER:
2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner
 

The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.

148005
EVG  

EVG  

540 

List all items of this typeWafer Fabrication Equipment - Other

in Wafer Fabrication Equipment

1  
EV GROUP 540 WAFER BONDER:
2005 EVG 540 Wafer Bonder for all wafer bonding processes, such as anodic, thermo-compression and silicon direct bonding.


EVG Smartview Wafer to Wafer Bond Aligner see item 148001

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