Wire Assembly Equipment

  1. WEST-BOND ULTRASONIC WEDGE WIRE BONDER

    Manual Wedge Bonders

    WEST-BOND ULTRASONIC WEDGE WIRE BONDER

    Ultrasonic Wedge Wire Bonder

    Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices. Machine bonds insulated wire directly to thin film gold without the need to strip off insulation

    Representative photo

  2. WEST-BOND AUTOMATIC WEDGE BONDER

    Automatic Wedge Bonders

    WEST-BOND AUTOMATIC WEDGE BONDER

    Automatic Wedge Bonder

    Designed for RF,microwave and high-lead count semiconductor devices Bonds ultrasonically or thermosonically