Deposition Equipment for Semiconductor Manufacturing

  1. CHA SEC 1000 RAP ELECTRON BEAM EVAPORATOR

    Electron Beam Evaporators

    CHA SEC 1000 RAP ELECTRON BEAM EVAPORATOR

    Six Pocket Ebeam Gun, (2)Resistance Sources, 6kW Heater Array, 25.5" Bell Jar, Cryo Pumped The CHA SEC-1000-RAP high-vacuum EBeam deposition system designed for use in production and research environments.

  2. VARIAN 3190 SPUTTER SYSTEM

    Standalone Sputterers

    VARIAN 3190 SPUTTER SYSTEM

    Load locked single wafer sputter, cassette to cassette vertically mounted for sideways sputter

    Currently configured for 100mm wafers 3 Target mini-quantums RF Etch VIPS (Vacuum Isolated Processing Station) Residual Gas Analyzer

  3. MILL LANE ENGINEERING REEL COATER

    Standalone Sputterers

    MILL LANE ENGINEERING REEL COATER

    Reel Coater for Ribbon or Wire

    The model 412-3 is a two-chamber reel to reel web coater which deposits metal or alloys on wire or ribbon substrates by sputtering from two magnetron targets arranged in a closely spaced book array. Capacity is based upon 4" ID x 12" OD x 3" wide wire/ribbon spools. Wire diameter up to 0.035" (.9mm) may be coated at speeds ranging between 2 and 40 feet per minute depending on the coating thickness desired. Constant wire speed and tension are controlled in conjunction with other parameters which enable unattended operation for extended periods. A second chamber provides plasma pre cleaning prior to entering the sputter zone through a conductance limiting tube which allows different gas compositions and pressures for cleaning and coating.