Description:
Used Surface Technology Systems (STS) HBC2 Helium Backside Cooling Control Module removed from an STS MXP Multiplex ICP ASE HR Silicon Etcher.
The HBC2 is an OEM STS control module associated with the wafer helium backside cooling system used on STS Multiplex ICP semiconductor processing equipment. Backside helium cooling is used to provide thermal control of the wafer during plasma processing.
The donor system was equipped with wafer clamping and helium backside cooling.
This proprietary Surface Technology Systems module may be useful as a replacement or service spare for existing STS / SPTS Multiplex equipment.
Condition: Used. Removed from decommissioned equipment. Not independently tested after removal.
PLEASE NOTE: This listing is for the item described in the title and description only. Other modules, components, equipment, or accessories visible in the photographs are shown for reference and are not included in the sale.
